Experience the revolutionary i.MX 8ULP applications processor family, designed for ultra-low power consumption and fortified with EdgeLock® secure enclave for advanced security at the intelligent edge.
NXP’s innovative Energy Flex architecture in the i.MX 8ULP processors optimizes energy efficiency at the chip level. This groundbreaking technology combines heterogeneous domain computing, advanced design techniques, and cutting-edge process technology. With a dedicated power management subsystem offering over 20 power mode combinations, the i.MX 8ULP delivers exceptional energy efficiency for a wide array of applications.
The i.MX 8ULP family features up to two Arm® Cortex®-A35 cores running at 800 MHz, an Arm Cortex-M33 core, 3D/2D Graphics Processing Units (GPUs), and a Cadence® Tensilica® Fusion DSP for low-power audio/voice, ML processing.
Introducing the VEST OSM (Small) i.MX 8ULP SOM, ideal for a diverse range of applications, such as:
• Smart Home and Building Automation
• Wearables and Health Monitoring
• Portable Test and Measurement Equipment
• Energy-Efficient Voice Solutions
• Human Machine Interfaces (HMI)
Key Features
• Ultra-Low Power Consumption by leveraging NXP’s Energy Flex architecture
• Integrated EdgeLock® secure enclave for enhanced security
• Low-power audio/voice application with Tensilica® Fusion DSP
• SGeT-compliant OSM design for simplified development and manufacturing
Specifications
CPU
2x Cortex®-A35 @ 800MHz, Cortex®-M33 @ 216MHz
GPU
GC7000UL with 2 shaders for 3D Graphics | GC520L for 2D | PXP
Memory
2GB (up to 2GB) 32-bit LPDDR4
Storage
16GB (up to 256GB) eMMC 5.1
SD Card Storage
SDIO 3.0
Form Factor
OSM Size-S (Small) module 30mm x 30mm
Operating Temperature
Commercial | Industrial (Optional)
Wireless
SDIO 3.0
Networking
10/100 Mbps RMII
USB
2x USB 2.0 OTG
Serial Communication
2x UART (TX,RX,CTS,RTS) | 3x UART (TX,RX) | CAN FD | 2x SPI | 6x PWM
I2C
2x I2C | 1x I3C
GPIO
24 GPIO (can use to configure 8 Ch DMIC) | 2x I2S
Debugging
JTAG
Power
5Vdc +/-5%
Camera
MIPI CSI (2-lane)
Display
MIPI DSI (4-lane), 18-bit RGB
Hi-Fi Audio
Tensilica® Fusion DSP for low power audio
Audio
I2S
SOC
EdgeLock® Secure Enclave
Secure IOT/Cloud
EdgeLock® Secure Enclave