i.MX95 Mini-ITX Development Kit with DeepX

Introducing the VEST SMTX i.MX95-D Vision AI Kit, perfectly suited for applications ranging from smart retail to rugged industrial automation. This solution combines a high-performance i.MX95 SMARC 2.2 System on Module (SoM) with a feature-rich Mini-ITX carrier board. By hosting the DeepX (DX-M1) AI Accelerator delivering up to 25 TOPS, and providing all necessary peripheral connectivity, this kit offers a complete platform for your next-generation designs.

High-Performance Processing and 3D Graphics

NXP i.MX95 application processor, featuring:

6x Arm® Cortex®-A55 cores for advanced Edge computing
Dual Real-Time Subsystem (Cortex®-M7/M33) for low-latency control
Arm® Mali™ GPU delivering smooth 3D graphics for advanced Human Machine Interfaces (HMI)
Advanced video processing with simultaneous 4K H.264/H.265 encoding and decoding, and an integrated ISP for high-resolution, secure imaging

Edge AI and Vision Capabilities

Dual-NPU architecture for balanced performance and power efficiency:

NXP eIQ® Neutron NPU (8.0 eTOPS at 1GHz) optimized for low-latency, sensor-level inference
DeepX (DX-M1) module delivering 25 TOPS with high power efficiency (1–5W),
connected via M.2 Key M and purpose-built for advanced Vision AI workloads
Supports DEEPX DXNN™ SDK for streamlined AI model optimization, deployment, and accelerated inferencing

Secure, Connected and Scalable

Connectivity: Dual GbE with TSN support (one PoE 25W port) and a 10GbE for high-bandwidth data transmission
Security: Intergrated NXP EdgeLock® Secure Enclave and Safety: SIL 2 (Optional)
Expansion: Flexible M.2 slots (Key E, Key B) with support for LTE/5G, and custom I/O

This Dev Kit is versatile and suitable for a wide range of applications, such as:

Smart Industrial: Industry 4.0, Robotics, Smart Factory Automation
Vision Systems: Edge Cameras, Smart Cities, Smart Retail/POS
Enterprise: Video/Audio Conferencing, Advanced Human Machine Interface
Specialized: Medical imaging, Test and Measurement Instruments, Smart Mobility

Specifications

CPU Details

CPU
Up to 6x Cortex®-A55 @ 1.8GHz (Ind)/2Ghz (Com), 1x Cortex®-M7, 1x Cortex® -M33

GPU
Arm® Mali-G310, OpenGL® ES 3.2, Vulkan® 1.2, OpenCL 3.0

NPU
NXP eIQ® Neutron NPU up to 8.0 eTOPS at 1Ghz (eTOPS: equivalent TOPS)

Package
NXP VZ (19mm x 19mm, 0.7mm pitch)

Memory

Memory
Up to 16GB, 6.4 GT/s × 32 LPDDR5 (with inline ECC)

Storage
Up to 256GB eMMC 5.1

External Storage
Mirco SD Slot

Operating System / Driver / Security

Operating System / Driver

SOC | External | Safety

EdgeLock® Secure Enclave | SE050 (Optional) | SIL-2 (IEC61508) Optional

Physical

Form Factor
170mm x 170mm (Mini ITX)
82mm x 50mm (SMARC)

Buttons
Power, Reset, Force Recovery

Operating Temperature
Commercial | Industrial (Optional)

Connectivity

Wireless
Wi-Fi 6/7, Bluetooth 5.3 (Optional)

Networking
2x 1GbE with PHY, TSN & IEEE 1588 support (1× PoE 25W)

1x 10 GbEthernet

USB
4x Type-A USB 3.0, Type-A USB 2.0, USB 2.0 OTG Type-C

Stacked D-SUB
Upper Stack: RS-232/422/485 (Software selectable)
Lower Stack: 2x CAN

Real Time Clock
12mm Diameter Coin Battery holder (Optional)

Debugging
2x UART, JTAG

Power
5V DC +/-5%, USB Type-C with PD (65W, 20V Maximum) or PoE (25W)

Multimedia

VPU
Decoder: H.264, H.265, 4Kp60 | Encoder: H.264, H.265, 4Kp60

Display
Dual Channel LVDS interface up to 1080p60 | 1x MIPI DSI (4-Lane) | up to 3840x1440p60 (optional) | 7″ or 10″ LCD with I2C touch | 1x HDMI Type A (Optional)

Audio
Audio Codec SGTL5000, 3.5mm Audio Jack (Line In, Mic) | 10W Max Speaker Header

Expansion Slot

Display
M.2 Key B for Display Signal Expansion (LVDS0/DSI0. LVDS1, PWM, I2C, GPIO)

Camera
2x 4-lane MIPI CSI, Cam CLK, I2C, SPI, GPIO

M.2 Key E (2230)
1x 1-lane PCIe Gen 3.0, SDIO, USB 2.0, UART(TX,RX,CTS,RTS), I2S, I2C

M.2 Key B 2280 (USB 3.0, Nano SIM Card)
LTE/5G

Audio
FFC (2x I2S, I2C, 4x GPIO)

DeepX (DX-M1) M.2 2280 Module Features

AI Performance
25 TOPS (INT8)

Host Interface
PCIe Gen3 x1

Memory Interface
4GB LPDDR5 (5600 MT/s)

Power Consumption
1W (min) ~ 5W (max)