Introducing the VEST i.MX95 SMARC Development (Dev) Kit. This next generation solution combines a high performance SMARC 2.2 System on Module (SOM) with a robust, feature rich Carrier Board, designed to unlock the full potential of NXP’s most advanced application processor.
Empowered by the NXP i.MX95, featuring up to 6x ARM® Cortex® A55 cores, real-time Cortex® M7 and Cortex® M33 subsystems, and the new NXP eIQ® Neutron NPU delivering up to 2 TOPS, this platform is built for compute intensive edge applications. It offers a major leap forward in AI acceleration, advanced security using EdgeLock® Secure Enclave, next gen graphics via Arm® Mali G310 GPU, and rich multimedia capabilities with 4K video encode/decode support.
This Dev Kit is versatile and ideal for a diverse range of applications, such as:
- Edge Computing
- Video/Audio Conferencing
- Advanced Human Machine Interface Application
- Point of Sales, Digital Signage, Smart Retail, Smart Cities
- Point of Care (Pumps, Respirators & Monitoring)
- Portable Test and Measurement Instruments
- Automation for Industry 4.0
Key Features
- Up to six Arm® Cortex®-A55 cores with Cortex®-M7 and Cortex®-M33 for high-performance, real-time processing with dual-display support
- Integrated 2 TOPS NPU enables efficient AI/ML acceleration using the NXP eIQ® ML toolkit, optimized for high-performance
embedded edge applications - Arm® Mali™ GPU delivers smooth 3D graphics and display capabilities up to 4Kp30 resolution, offering rich multimedia capabilities
- Dual MIPI CSI interfaces (one shared with MIPI DSI) for high resolution camera applications
- Dual Gigabit Ethernet with two ports for TSN collaborating with NXP Real Time Edge Software for deterministic control with
precise time-synchronization - Enhanced security with EdgeLock® Secure Enclave and SIL 2 safety option
- Flexible expansion with multiple M.2 slots (Key M, Key E, Key B) provide expansion for NVMe storage, high-speed wireless modules, and custom I/O
Specifications
CPU
Up to 6x Cortex®-A55 @ 1.8GHz (Ind)/2Ghz (Com), 1x Cortex®-M7, 1x Cortex® -M33
GPU
Arm® Mali-G310, OpenGL® ES 3.2, Vulkan® 1.2, OpenCL 3.0
NPU
NXP eIQ® Neutron NPU up to 2.0 TOPS
Package
NXP VZ (19mm x 19mm, 0.7mm pitch)
NXP VT (15mm x 15mm, 0.5mm pitch)
Memory
Up to 16GB, 6.4 GT/s × 32 LPDDR4X (with inline ECC)
Storage
Up to 256GB eMMC 5.1
External Storage
Mirco SD Slot
Operating System / Driver
Security
SOC – EdgeLock® Secure Enclave
External – SE050 (Optional)
Safety – SIL-2 (IEC61508) optional
Form Factor
170mm x 170mm (Mini ITX)
82mm x 50mm (SMARC)
Buttons
Power, Reset, Force Recovery
Operating Temperature
Commercial | Industrial (Optional)
Wireless
Wi-Fi 6/Bluetooth 5.3 (Optional)
Networking
1GbEthernet with PHY and support TSN, IEEE 1588
1GbEthernet with PHY support TSN, with POE (25W)
1x 10 GbEthernet (only on 19x19mm package)
USB
4x Type-A USB 3.0, Type-A USB 2.0, USB 2.0 OTG Type-C
CAN
2x Stacked D-SUB
RS232/422/485
1x Stacked D-SUB (Software selectable)
Real Time Clock
12mm Diameter Coin Battery holder (Optional)
Debugging
2x UART, JTAG
Power
5V DC +/-5%, USB Type-C with PD (65W, 20V Maximum) or PoE (25W)
Video Encoder
H.264, H.265, 4Kp60
Video Decoder
H.264, H.265, 4Kp60
Camera**
1x MIPI CSI (2-lane) shared with MIPI DSI
Display**
Dual Channel LVDS interface up to 1080p60 | 1x MIPI DSI (4-Lane) | up to 3840x1440p60 (optional) |
7″ or 10″ LCD with I2C touch | 1x HDMI Type A (optional)
Audio
Audio Codec SGTL5000, 3.5mm Audio Jack (Line In, Mic) | 10W Max Speaker Header
Display
M.2 Key B for Display Expansion (LVDS0/DSI0. LVDS1, PWM, I2C, GPIO)
Audio
FFC (2x I2S, I2C, 4x GPIO)
Camera
2x 4-lane MIPI CSI, Cam CLK, I2C, SPI, GPIO
M.2 Key M (2280)
1x 1-lane PCIe Gen 3.0, I2C
M.2 Key E (2230)
1x 1-lane PCIe Gen 3.0, SDIO, USB 2.0, UART(TX,RX,CTS,RTS), I2S, I2C
M.2 Key B (USB 3.0) 2280
Nano SIM Socket
** Combination options due to i.MX95 multiplexing MIPI DSI and MIPI CSI. Contact sales@apc-vest.com
