Introducing the VEST SMTX i.MX95-D Development Kit, perfectly suited for Edge AI Vision applications ranging from smart retail to rugged industrial automation. This solution combines a high-performance i.MX95 SMARC 2.2 System on Module (SoM) with a feature-rich Mini-ITX carrier board. By hosting the DeepX (DX-M1) AI Accelerator deliver up to 25 TOPS, and providing all necessary peripheral connectivity, this kit offers a complete platform for your next-generation designs.
High-Performance Processing and 3D Graphics
NXP i.MX95 application processor, featuring:
- 6x Arm® Cortex®-A55 cores for advanced Edge computing
- Dual Real-Time Subsystem (Cortex®-M7/M33) for low-latency control
- Arm® Mali™ GPU delivering smooth 3D graphics for advanced Human Machine Interfaces (HMI)
- Advanced video processing with 4K H.264/H.265 encoding and decoding, and an integrated ISP for high-resolution, secure imaging
Edge AI Vision Capabilities
Dual-NPU architecture for balanced performance and power efficiency:
- NXP eIQ® Neutron NPU (2.0 TOPS) optimized for low-latency, sensor-level inference
- DeepX (DX-M1) module delivering 25 TOPS with high power efficiency (1–5W),
connected via M.2 Key M and purpose-built for advanced Vision AI workloads
Secure, Connected and Scalable
NXP i.MX95 application processor, featuring:
- Connectivity: Dual GbE with TSN support (one PoE 25W port) and a 10GbE for high-bandwidth data transmission
- Security: Intergrated NXP EdgeLock® Secure Enclave and Safety: SIL 2 (Optional)
- Expansion: Flexible M.2 slots (Key E, Key B) for NVMe storage, high-speed Wi-Fi, and custom I/O
This Dev Kit is versatile and ideal for a diverse range of applications, such as:
- Smart Industrial: Industry 4.0, Robotics, Smart Factory Automation
- Vision Systems: Edge Cameras, Smart Cities, Smart Retail/POS
- Enterprise: Video/Audio Conferencing, Advanced Human Machine Interface
- Specialized: Medical imaging, Test and Measurement Instruments, Smart Mobility
Specifications
CPU
Up to 6x Cortex®-A55 @ 1.8GHz (Ind)/2Ghz (Com), 1x Cortex®-M7, 1x Cortex® -M33
GPU
Arm® Mali-G310, OpenGL® ES 3.2, Vulkan® 1.2, OpenCL 3.0
NPU
NXP eIQ® Neutron NPU up to 2.0 TOPS
Package
NXP VZ (19mm x 19mm, 0.7mm pitch)
Memory
Up to 16GB, 6.4 GT/s × 32 LPDDR4X (with inline ECC)
Storage
Up to 256GB eMMC 5.1
External Storage
Mirco SD Slot
Operating System / Driver
SOC | External | Safety
EdgeLock® Secure Enclave | SE050 (Optional) | SIL-2 (IEC61508) Optional
Form Factor
170mm x 170mm (Mini ITX)
82mm x 50mm (SMARC)
Buttons
Power, Reset, Force Recovery
Operating Temperature
Commercial | Industrial (Optional)
Wireless
Wi-Fi 6/Bluetooth 5.3 (Optional)
Networking
1GbEthernet with PHY and support TSN, IEEE 1588
1GbEthernet with PHY support TSN, with POE (25W)
1x 10 GbEthernet
USB
4x Type-A USB 3.0, Type-A USB 2.0, USB 2.0 OTG Type-C
CAN
2x Stacked D-SUB
RS232/422/485
1x Stacked D-SUB (Software selectable)
Real Time Clock
12mm Diameter Coin Battery holder (Optional)
Debugging
2x UART, JTAG
Power
5V DC +/-5%, USB Type-C with PD (65W, 20V Maximum) or PoE (25W)
VPU
Decoder: H.264, H.265, 4Kp60 | Encoder: H.264, H.265, 4Kp60
Display
Dual Channel LVDS interface up to 1080p60 | 1x MIPI DSI (4-Lane) | up to 3840x1440p60 (optional) | 7″ or 10″ LCD with I2C touch | 1x HDMI Type A (Optional)
Audio
Audio Codec SGTL5000, 3.5mm Audio Jack (Line In, Mic) | 10W Max Speaker Header
Display
M.2 Key B for Display Expansion (LVDS0/DSI0. LVDS1, PWM, I2C, GPIO)
Camera
2x 4-lane MIPI CSI, Cam CLK, I2C, SPI, GPIO
M.2 Key E (2230)
1x 1-lane PCIe Gen 3.0, SDIO, USB 2.0, UART(TX,RX,CTS,RTS), I2S, I2C
M.2 Key B (USB 3.0) 2280
LTE/5G
Audio
FFC (2x I2S, I2C, 4x GPIO)
AI Performance
25 TOPS (INT8)
Host Interface
PCIe Gen3 x1
Memory Interface
4GB LPDDR5 (5600 MT/s)
Power Consumption
1W (min) ~ 5W (max)
Operating
Temperature
-40 ~ 85°C (Industrial)
OS Support
Debian-based Linux, Yocto Project
AI Frameworks
Ultralytics, TensorFlow, PyTorch, ONNX, Keras
Ordering Information and Enquiries: please contact sales@apc-vest.com
